Accurex Semicon
Accurex Semicon

Semiconductor backend, end to end.

Backend semiconductor assembly and test — wafer handling, die attach and bonding, package inspection and the consumables that carry wafers between them.

24 lines · 4 groups
The range24 lines · 04 groups
01

Wafer Handling

7 lines

Wafer Taping / Laminator / Mounter

Wafer Back Grinder

Wafer Bump 3D AOI Inspection

Wafer KGD Handler

  • Nexustest

Plasma Dicing

  • ASETS

Wafer Dicing Surfactant

  • Millice

Particle Cleaning Surfactant

  • Millice
02

Assembly Process Equipment

7 lines

Plasma Systems

  • Nordson

Die Bonder

  • Axxon
  • MRSI

BGA Ball Attach

  • Koses

Camera Module Lens Assembly

  • KIT

Wire Bonding

Solder Ball Attach

  • Koses

Form & Trim / Package Preparation

03

Inspection & Test

7 lines

X-Ray Inspection (2D, 3D, AXI)

  • Nordson

Scanning Acoustic Microscopy (CSAM)

  • PVA TePla

Bond Tester

  • Nordson

Warpage & Topography Measurement (TDM)

  • Insidix

Optical Inspection

  • Intek Plus

Pick and Place Test Handlers

  • JHT Design

Modular ATE Platforms — Analog IC / PMIC / Power Discrete

  • AccoTEST
04

Consumables

3 lines

Wafer Frames

  • YJ Stainless

Frame Cassette

  • YJ Stainless

Wafer Boxes

  • YJ Stainless
In detail08 of 24 lines

Represented by Accurex Semicon, with installation, calibration and after-sales support from the same factory-trained engineers.

01

Manual Bonders

2 options
Die Bonder — Manual Bonders
ManufacturerDie Bonder
  • TRUE VERTICAL TECHNOLOGY™ with 95mm Z-movement
  • Simultaneous viewing of two objects by an optical overlay (superposition) on the monitor.
  • Touchscreen for selection of pick & place, dispensing, stamping
Manual Wire Bonder — Manual Bonders
ManufacturerManual Wire Bonder
  • 7” TFT Touch Screen Management
  • 800MB Capacity
  • Windows CE-based management software
  • Internal Tools database
  • Large 6” X 6” bonding area
  • Built-in temperature controller
02

Bond Tester

4000Plus Bondtester — Bond Tester
Manufacturer4000Plus Bondtester
  • Highly Versatile
  • Switch Applications in Just Seconds
  • Increased Efficiency
  • Ultimate Step Back Accuracy
  • Correlation
  • Intelligent Software
04

X-Ray Inspection

X-Ray Inspection - Quadra-7 — X-Ray Inspection
ManufacturerX-Ray Inspection - Quadra-7
  • Leading core technology
  • High performance and ease of use
  • Leading choice for printed circuit board and semiconductor package inspection.
  • 0.35μm (350nm) Feature Recognition up to 10 W Tube power
  • Total Magnification 45,000 X
  • AχiS - Active X-ray Image Stabilisation
05

Camera Lens Module Assembly Machine

Camera Lens Module Assy Machine — Camera Lens Module Assembly Machine
ManufacturerCamera Lens Module Assy Machine
  • Engage the lens module at a constant height to the VCM housing using precision vision technology
  • Torque control and precision laser sensor are applied to prevent parts from being damaged and to realize precise tightening height control​
  • Apply two tightening units to increase productivity
  • Precision stage for fine-tuning to correct processing errors of lens jigs is applied in addition to the basic driveshaft​
  • Gore cables and anti-foreign measures are applied to minimize foreign substances generated during facility operation.
06

BGA Ball Attach

Solder Ball Attach — BGA Ball Attach
ManufacturerSolder Ball Attach
  • Length: 180 ~ 250mm / Width: 30 ~ 100mm
  • Free Fall(Gravity) or Ejector Pin Pushing
  • PRS(Patten Recognition System) Vision Alignment
  • Dual Shuttle(Front/Rear)
07

Automatic Die Bonding

For high volume production — Automatic Die Bonding
ManufacturerFor high volume production
  • 1.5 micron die bonding For high volume production
  • Fully automated, high-speed, high-precision, high flexibility
  • Scaling applications, ultimate speed
  • High Volume Solutions
  • The MRSI-HVM Family is the best-in-class die bonder, offering leading speed, zero-time tool change, and <1.5 micron accuracy.
  • The MRSI-H Family provides proven superior flexibility for true multi-die, multi-process, multi-product high-volume high-mix production with <1.5 micron accuracy.
Also from Accurex

The full SMT line, from Accurex Solutions.

Board handling and paste through placement, soldering, coating, cleaning and inspection — supplied and serviced by the same engineers, under Accurex Solutions Pvt. Ltd.

SMT line solutions

Specifying a backend line?

Tell us the package, the volume and the test coverage you need. You will get an engineer who has specified the line before.

Talk to an engineer